Production

Production Process

  • 01
    Laser Drilling  For Ceramic PCB Production-bstceramicpcb
    Laser Drilling

  • 02
    Ceramic Substrate Magnetron Sputtering-bstceramicpcb
    Magnetron Sputtering

  • 03
    Grinding Board Ceramic PCB-bstceramicpcb
    Grinding Board

  • 04
    Exposure Ceramic PCB Original Factory-bstceramicpcb
    Exposure

  • 05
    Electroplating For Ceramic PCB -bstceramicpcb
    Electroplating

  • 06
    Ceramic PCB Des-bstceramicpcb
    Des

  • 07
    OSP (Organic Solderability Preservative) Machine-bstceramicpcb
    OSP

  • 08
    Solder mask printing From Original Ceramic PCB Factory-bstceramicpcb
    Solder mask printing

  • 09
    Flying Probe Testing Of Ceramic PCB Manufacturing-bstceramicpcb
    Flying Probe Testing

  • 010
    FQC For Ceramic Substrate-bstceramicpcb
    FQC

Production Process Video Introduction

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Process Capability

Project Thick film ceramic board process capabilities DBC/DCB Copper Copy Ceramics Square Process Capability DPC direct copper plating ceramic substrate process capacity AMB activated metal welding ceramic substrate
Number of circuit layers 10 layer 2 layer 2 layer 2 layer
Biggest size 200*200mm 138*178mm 138*190mm 114*114mm
Minimum board thickness 0.25mm 0.30mm~0.40mm 0.25mm 0.25mm
Maximum board thickness 2.0mm 1L: 1.3mm; 2L: 1.6mm 2.0mm 1.8mm
Conductor thickness 5um-13um 3.9oz-8.6oz 2um-200um 8oz-22.9oz
Minimum line width/line distance 6/8mil (0.15/0.20mm) 12/12mil (0.30/0.30mm) 6/8mil (0.15/0.20mm)     20/20mil (0.50/0.50mm)
Substrate One aluminum, aluminum nitride, oxidation, oxide Alumina, aluminum nitride, oxide Alumina, aluminum nitride, oxide, silicon nitride Aluminum nitride, silicon nitride
Base material 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.25, 1.5, 2.0mm 0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.25, 1.5, 2.0mm 0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm
Minimum 4mil (0.1mm)
Minimum hole distance NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Minimum PAD ring (single) 6mil(0.15mm) N/A 3mil(0.075mm) N/A
PTH minimum hole wall copper thickness 4mil(10um) N/A 4mil (10um) N/A
Welding pad minor diameter 10mil(0.25mm) 8mil(0.20mm) 6mil(0.15mm) 8mil(0.20mm)
Group welding bridge 12mil(0.30mm) 8mil(0.20mm) 6mil(0.15mm) 8mil(0.20mm)
BGA pads minimum spacing 12mil(0.30mm) 8mil(0.20mm) 5mil(0.125mm) 8mil(0.20mm)
PTH/NPTH pore diameter tolerance PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Pole bias tolerance ± 4mil (0.1mm)      
Tolerance Laser cutting: +0.2/0.05mm; Mold type type: +0.25/0.20mm Laser cutting: +0.2/0.05mm Laser cutting: +0.2/0.05mm; Mold type type: +0.25/0.20mm Laser cutting: +0.2/0.05mm
Line width/line distance tolerance ± 5mil (0.125mm) ± 5mil (0.125mm) ± 1mil (0.025mm) ± 5mil (0.125mm)
Surface treatment AgPd, AuPd, Mn/Ni OSP antioxidant/nickel plating, Shen Jin OSP Antioxidation/Sinking Gold/Nickel Gold OSP antioxidant/nickel plating, Shen Jin
Thermal Stress 1 hour @ 350℃ 3 x 10 Sec @ 280 ℃ 15 min @ 350 ℃ 3 x 10 Sec @ 280 ℃

 

Mechanical Equipment
Ceramic PCBsurface treatment-BSTCeramicPCB

surface treatment

Ceramic Substrate Magnetron sputtering-BSTceramicPCB

Magnetron sputtering

Ceramic PCB Pre-processing Manufacturing Process Machine-BSTceramicPCB

Pre-processing

Ceramic Substrate Exposure Machine-bstceramicpcb

Exposure Machine

Ceramic PCB Solder Mask-BSTceramicPCB

Solder Mask

Ceramic PCB laser drilling-BSTCeramicPCB

laser drilling

Ceramic Substrate developing-etching-stripping-BSTceramicPCB

Developing-Etching-Stripping

Ceramic PCB Electroplating production line-BSTceramicPCB

Electroplating production line

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