DBC/DCB PCB
Tiny Size DBC Ceramic Substrate PCB For Scientific Education
Tiny Size DBC Ceramic Substrate PCB For Scientific Education
Tiny Size DBC Ceramic Substrate PCB For Scientific Education
Tiny Size DBC Ceramic Substrate PCB For Scientific Education
Tiny Size DBC Ceramic Substrate PCB For Scientific Education

Tiny Size DBC Ceramic Substrate PCB For Scientific Education

Substrate material: 96% Al2O3
Board Thickness: 2.0mm+/-10%
Conductor: 300um AgPd
Solder Mask: N/A
Silkscreen: N/A
Surface Finishing: ENIG 1u"
Application: Scientific Education
Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 DCB/DBC Capabilities

Layer Count

1-2 Layers

Max Board Dimension

120mmx180mm

Min Board Thickness

0.254mm

Max Board Thickness

2.0mm

Conductor Thickness

100-600μm

Min Line Width/Line Space

300/300μm

Substrate Type

AI2O3

Substrate Thickness

0.254-2.0mm

Min Hole Diameter

0.25mm (No Via Hole)

Min Hole Spacing

250μm

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

N/A

Min Solder PAD Dia

0.5mm

Min Soldermask Bridge

Green Oil 130μm; Others 150μm

Min BAG PAD Margin

0.35mm

PTH/NPTH Dia Tolerance

0.075mm

Hole Position Deviation

75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated

Thermal Stress

7.3ppm/k

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI2O3

Base Material Thickness (exclude conductor)

0.45-3.2mm

Thermal Conductivity

24-170W/mk

Soldermask Type

Aluminum Oxide

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

>15KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170W/mk

Dielectric Strength

15KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

DCB/DBC Ceramic PCB

1 Layer

2 - 3 weeks

1.5 weeks

2 Layers

2 - 3 weeks

1.5 weeks

Production Layers Normal Service Expedited service

DCB/DBC Ceramic PCB

1 Layer

3 - 4 weeks

1.5 - 2 weeks

2 Layers

3 - 4 weeks

1.5 - 2 weeks

Education Systems Direct Bonding Copper PCB Manufacturing Process-Bestceramicpcb

DBC (Direct Bonding Copper) is a technology that bonds the copper conductor on the ceramic substrate directly under an appropriate temperature. The binding force between the pure copper and the ceramic substrate is very reliable.

 

1. Material: Aluminum Nitride/Aluminum Oxide/ZrO2

 

2. Function: Heat dissipation ceramics and electrical insulation.

 

3. Type: Metallized ceramic.

 

4. Custom service available.

Scientific Education Ceramic DBC PCB Fast Programing Fabrication-Bestceramicpcb

Background:

Bioly Electronics is a company that specializes in developing innovative technologies for the life sciences industry. They are planning to design a new electrochemical biosensor for a research project, and they have decided to use a ceramic PCB as the base plate for the biosensor.

At the initial step in the design process was to select the appropriate substrate material for the biosensor. After considering various options, Bioly Electronics chose a double-sided DBC ceramic PCB due to its excellent electrical insulation and high thermal conductivity. The ceramic substrate provides a stable and reliable platform for the biosensor to function on.

 

Project Challenge:

  1. The copper thickness required 300um, it is not easy to plate such thick copper in one time.
  2. The copper surface should have good flatness, it is difficult to control especially copper needs to be plated multiple times to achieve 300um.
  3. It is a big challengeA to protect the copper surface from scratch during the complex manufacturing process.

 

DBC ceramic PCB for Biosensor application:

An electrochemical biosensor is a device that detects biological or chemical species by converting the biochemical reaction into an electrical signal. A Double-Sided DBC Ceramic Circuit Board was used as the substrate for the biosensor due to its good performance. The biosensor was fabricated by depositing a metal layer onto the substrate and immobilizing the biorecognition element on the metal surface using a biofunctionalization process. This process involved the covalent attachment of the biorecognition molecules to the metal surface, which allowed for the specific detection of the target analyte. The DBC ceramic substrate provided excellent electrical insulation and high thermal conductivity, which were critical for the biosensor's performance. After testing, the biosensor exhibited high sensitivity and selectivity, indicating that it was well-suited for its intended application.

 

Results and Benefits:

Customer was satisfied to our hard work because the ceramic board performed excellent when mounted into the biosensor, makes it is well-suited for the end application. Now we are the only one ceramic board long-established supplier of Bioly in China, and we fabricate more than 10,000 pieces such board for them every month.

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