DPC PCB
DPC Al2O3 Ceramic Substrate Circuit Board For Cooler
DPC Al2O3 Ceramic Substrate Circuit Board For Cooler
DPC Al2O3 Ceramic Substrate Circuit Board For Cooler
DPC Al2O3 Ceramic Substrate Circuit Board For Cooler

DPC Al2O3 Ceramic Substrate Circuit Board For Cooler

Substrate material: 96% Al2O3
Board thickness: 0.38mm+/-0.1mm
Conductor: 35um copper, 200um copper in specific area
Solder mask: N/A
Silkscreen: N/A
Surface finishing: ENEPIG 3u’’
Application: Cooler

Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 DPC Capabilities

Layer Count

1-2 Layers

Max Board Dimension

120mmx180mm

Min Board Thickness

0.15mm

Max Board Thickness

6.0mm

Conductor Thickness

50/50μm

Min Line Width/Line Space

3/3mil (0.075/0.075mm)

Substrate Type

AI2O3, ALN, Si3N4

Substrate Thickness

0.15-6mm

Min Hole Diameter

100μm

Min Hole Spacing

250μm

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

8um

Min Solder PAD Dia

0.25mm

Min Soldermask Bridge

Green Oil 130μm; Others 150μm

Min BAG PAD Margin

0.3mm

PTH/NPTH Dia Tolerance

0.05/0.075mm

Hole Position Deviation

50-75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated

Thermal Stress

7.3pmm/k

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI2O3 

Base Material Thickness (exclude conductor)

0.15-6mm

Thermal Conductivity

24-170W/mk

Soldermask Type

Aluminum Oxide

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

15 KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170 W/mk

Dielectric Strength

>15 KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

DPC Ceramic PCB

1 Layer

DPC: 2 - 3 weeks

DPC: 1.5 weeks

2 Layers

DPC: 2 - 3 weeks

DPC: 1.5 weeks

Production Layers Normal Service Expedited service

DPC Ceramic PCB

1 Layer

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

2 Layers

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

Cooler Application Ceramic DPC PCB Manufacturing Process-Bestceramicpcb

Best Technology: Leading DPC Ceramic PCB Manufacturer

Best Technology is a premier manufacturer in the ceramic PCB industry, renowned for their commitment to excellence and customizable solutions. Here's why they stand out:

  1. Expertise and Technical Know-How: With highly skilled engineers and technicians, Best Technology offers extensive expertise and stays ahead of industry trends to provide innovative solutions.
  2. Comprehensive Design Support: Best Technology provides comprehensive design support, collaborating closely with clients on FPC design optimization, material selection, and manufacturability to ensure high-quality and high-performance outcomes.
  3. Prototyping and Fast Turnaround: They offer rapid prototyping services and fast turnaround times, allowing customers to validate designs quickly and meet tight project deadlines.
  4. Superior Quality and Reliability: Best Technology prioritizes quality control, utilizing advanced testing equipment and rigorous inspection procedures to deliver superior, reliable DPC ceramic PCBs that exceed customer expectations.

DPC ceramic PCB specification:

Substrate material:

96% Al2O3

Board thickness:

0.38mm+/-0.1mm

Conductor:

35um copper, 200um copper in specific area

Solder mask:

N/A

Silkscreen:

N/A

Surface finishing:

ENEPIG 3u’’

Application:

Cooler

Portable Cooling Device DPC Ceramic PCB Design Making Vendor-Bestceramicpcb

Background:

OptoTech is a company of VSCEL laser technologies, specializing in high-performance VSCEL lasers. They cater to various industries such as telecommunications, medical devices, and scientific research. OptoTech Solutions is facing challenges with the thermal management and electrical performance of their VSCEL lasers, which are crucial for maintaining laser stability and efficiency. They are seeking a reliable ceramic PCB supplier that can provide high-quality ceramic circuits for their VSCEL laser systems.

 

PCB challenge:

  1. The ceramic PCB needs a very good flatness to perform good thermal management for their VECEL lasers.
  2. The whole board is covered by copper, it is not easy to protect from oxidation and scratch.
  3. Some specific areas required 200um copper, so it needs to proceed plating process several times to achieve the required thickness, which will affect the surface flatness.
  4. The customer wants to add solder paste on the pads for 1mm, it is difficult to control the thickness, especially since the copper thickness is different on some pads.

 

Solution:

During the second plating, we protected the copper surface so that no need to add extra copper by film, all the operators paid high attention during the whole process, and finally we finished the products and applied the solder paste successfully by a stepped stencil.

 

Result and Benefits:

The customer appreciated our hard work and dedicated work attitude, they gave us a big thump up and sent some other similar projects to us. Now we are still in cooperating new project.

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