LTCC PCB
EPS Power Systems PCB Design LTCC Ceramic Substrate
EPS Power Systems PCB Design LTCC Ceramic Substrate
EPS Power Systems PCB Design LTCC Ceramic Substrate
EPS Power Systems PCB Design LTCC Ceramic Substrate
EPS Power Systems PCB Design LTCC Ceramic Substrate

EPS Power Systems PCB Design LTCC Ceramic Substrate

Substrate material: 96% Al2O3
Board Thickness: 1.0mm
Conductor: 0.1umTiW+3.0um Ni
Solder Mask: N/A
Silkscreen: N/A
Surface Finishing: N/A
Application: EPS Power Systems
Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 LTCC Capabilities

Layer Count

4-64 Layers

Max Board Dimension

150mm×150mm

Min Board Thickness

Single layer 0.1mm, total thickness 0.15mm

Max Board Thickness

Single layer 0.25mm, total thickness 6mm

Conductor Thickness

6-12μm (the surface layer can be thickened to 80μm)

Min Line Width/Line Space

150μm (surface layer can be refined to 50μm)

Substrate Type

Al2O3

Substrate Thickness

0.15-6mm

Min Hole Diameter

100μm

Min Hole Spacing

250μm

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

N/A

Min Solder PAD Dia

0.1mm

Min Soldermask Bridge

75μm

Min BAG PAD Margin

0.635mm

PTH/NPTH Dia Tolerance

10μm

Hole Position Deviation

30-40μm

Outline Tolerance

Laser cutting: 0.005; Die stamping: 0.005

Line Width/Spac Tolerance

±20%

Surface Treatment

Immersion Gold/Nickel Palladium Gold (Surface treatment is not recommended)

Thermal Stress

7.3ppm/K

Item2 Attribute

Base Material

DP951,DP9K7, Ferro-A6-M

Base Material Thickness (exclude conductor)

0.15-6mm

Thermal Conductivity

17W/mk

Soldermask Type

Aluminum Oxide

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

9.4 (1MHz); 9.1 (13GHz)

Dielectric Constant (MHZ)

≤0.5%

Water Absorption

0%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

17W/mk

Dielectric Strength

15KV/mm

Wrap & Twist

0.003

Prototype(<1m²) Layers Normal Service Expedited Service

LTCC Ceramic PCB

6 Layers

6 - 8 weeks

3 - 4 weeks

8 Layers

6 - 8 weeks

3 - 4 weeks

10 Layers

6 - 8 weeks

3 - 4 weeks

>10 Layers

6 - 8 weeks

3 - 4 weeks
Mass Production Layers Normal Service Expedited service

LTCC Ceramic PCB

6 Layers

7 - 9 weeks

4 - 5 weeks

8 Layers

7 - 9 weeks

4 - 5 weeks

10 Layers

7 - 9 weeks

4 - 5 weeks

>10 Layers

7 - 9 weeks

5 - 6 weeks

EPS Systems Low-temperature Co-fired Ceramic PCB Manufacturing Process-Bestceramicpcb

Understanding LTCC Ceramic PCBs

LTCC Ceramic PCBs are a type of multilayer circuit board that utilizes Low-Temperature Co-fired Ceramic technology. These PCBs consist of multiple layers of ceramic material with embedded conductive traces and vias. The ceramic material used, such as alumina or aluminum nitride, offers excellent thermal properties.

 

LTCC Ceramic PCBs leverage the ceramic material's ability to dissipate heat efficiently while providing electrical insulation. This unique combination makes them ideal for applications where high-frequency signals, miniaturization, and heat dissipation are crucial.

 

Advantages of LTCC Ceramic PCBs

Low thermal resistance for effective heat dissipation: LTCC Ceramic PCBs exhibit low thermal resistance, allowing rapid heat transfer from the electronic components to the outer layers of the PCB. This enables efficient heat dissipation and prevents temperature-related performance degradation.

 

Excellent insulation properties for electrical safety: The ceramic material used in LTCC Ceramic PCBs provides excellent electrical insulation. This ensures reliable isolation between conductive traces, reducing the risk of short circuits and electrical malfunctions.

 

Suitable for miniaturized and high-frequency applications: LTCC Ceramic PCBs are well-suited for applications that require miniaturization and high-frequency signal transmission. They find extensive use in sectors such as telecommunications, aerospace, medical devices, and wireless communication systems.

 

LTCC Ceramic PCBs are highly advantageous in applications where effective heat dissipation, electrical insulation, and high-frequency performance are essential.

Vehicle Electronics LTCC Ceramic PCB Design Guide-Bestceramicpcb

Background:

Customer Background:

AutoDrive Technologies is an automotive technology company specializing in EPS systems. They were seeking a reliable solution to enhance the performance and reliability of their EPS control modules.

 

Project Challenges:

AutoDrive Technologies faced challenges related to thermal management and signal integrity in their EPS power systems. They needed a solution that could efficiently dissipate heat, maintain high-speed signal transmission, and withstand harsh automotive environments.

 

Solution:

We collaborated closely with AutoDrive Technologies to develop custom LTCC ceramic PCBs for their EPS control modules. Our team of experts optimized the PCB layout, utilizing LTCC ceramic material for its excellent thermal conductivity and electrical properties. We offered customization options to accommodate AutoDrive Technologies' specific EPS system requirements. The LTCC ceramic PCBs were designed to integrate seamlessly with their existing control modules, simplifying the integration process and reducing overall system complexity. Benefits of LTCC ceramic PCB:

 

1. Thermal Management: LTCC ceramic PCBs offered excellent thermal conductivity, enabling efficient heat dissipation in EPS control modules. This resulted in improved performance, increased reliability, and extended lifespan of the systems.

 

2. Signal Integrity: LTCC ceramic material provided low dielectric losses and high signal transfer capabilities, ensuring reliable and high-speed signal transmission in EPS control modules. This contributed to enhanced system responsiveness and accuracy.

 

Result and benefit:

AutoDrive made a great success when apply the LTCC ceramic PCB into their EPS system, and by means of this innovation, they won some valued customers in the Canton fair. And obviously, we also became their reliable PCB supplier in Shenzhen.

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