DPC PCB
Double-sided Laser Equipment DPC Ceramic Circuit Board
Double-sided Laser Equipment DPC Ceramic Circuit Board
Double-sided Laser Equipment DPC Ceramic Circuit Board
Double-sided Laser Equipment DPC Ceramic Circuit Board
Double-sided Laser Equipment DPC Ceramic Circuit Board

Double-sided Laser Equipment DPC Ceramic Circuit Board

Substrate material: 96% Al2O3
Board thickness: 1.0mm+/-0.1mm
Conductor: 70um copper (top), 35um copper (bot)
Solder mask: N/A
Silkscreen: Black
Surface finishing: ENIG 1u’’
Application: Laser equipment



Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 DPC Capabilities

Layer Count

1-2 Layers

Max Board Dimension

120mmx180mm

Min Board Thickness

0.15mm

Max Board Thickness

6.0mm

Conductor Thickness

50/50μm

Min Line Width/Line Space

3/3mil (0.075/0.075mm)

Substrate Type

AI2O3, ALN, Si3N4

Substrate Thickness

0.15-6mm

Min Hole Diameter

100μm

Min Hole Spacing

250μm

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

8um

Min Solder PAD Dia

0.25mm

Min Soldermask Bridge

Green Oil 130μm; Others 150μm

Min BAG PAD Margin

0.3mm

PTH/NPTH Dia Tolerance

0.05/0.075mm

Hole Position Deviation

50-75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated

Thermal Stress

7.3pmm/k

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI2O3 

Base Material Thickness (exclude conductor)

0.15-6mm

Thermal Conductivity

24-170W/mk

Soldermask Type

Aluminum Oxide

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

15 KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170 W/mk

Dielectric Strength

>15 KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

DPC Ceramic PCB

1 Layer

DPC: 2 - 3 weeks

DPC: 1.5 weeks

2 Layers

DPC: 2 - 3 weeks

DPC: 1.5 weeks

Production Layers Normal Service Expedited service

DPC Ceramic PCB

1 Layer

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

2 Layers

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

Laser Equipment DPC Ceramic PCB Manufacturing Process-Bestceramicpcb

DPC Ceramic PCB is a type of printed circuit board made from ceramic materials with a copper layer directly plated onto the ceramic substrate. Based on the thin film technology, the metallization of the ceramic surface can be achieved by magnetron sputtering, and the thickness of the copper layer is greater than 10um by electroplating.

 

1. Material: Al2O3, AIN, ZrO2, Si3N4

2. Function: It has a lower coefficient of thermal expansion and higher conductivity, the small size makes it in a very narrow space.

3. Type: Thin film technology.

4. Custom service available.

 

DPC Ceramic PCB Specification:

 

Substrate material:

96% Al2O3

Board thickness:

1.0mm+/-0.1mm

Conductor:

70um copper (top), 35um copper (bot)

Solder mask:

N/A

Silkscreen:

Black

Surface finishing:

ENIG 1u’’

Application:

Laser equipment

Layer Equipment Application Direct Plated Copper PCB Design-Bestceramicpcb

Background:

Dallint electronics is a manufacturer of laser devices that used in various industries, including medical, industrial, and research sectors. In laser devices, the performance and efficiency of the circuit boards play a crucial role in ensuring accurate and stable laser output. The customer faced challenges with their existing circuit boards, such as limited thermal dissipation, signal degradation, and inadequate durability, which impacted the overall performance of their laser devices. With a commitment to delivering cutting-edge laser technology, the customer sought a supplier who enables to provide high quality circuit boards that can help to improve the performance and reliability of their laser devices.

 

Project challenge:

  1. Customer don’t have a gerber file, and they don’t know what kind of ceramic circuit board is suitable for their project.

 

Solution:

After constant communicating and analyzing with customers, they decided to implement the proposed solution using DPC ceramic circuit boards in their laser devices. The new design incorporated the advanced features of DPC boards to address the challenges they had been facing.

In their experiment, the DPC ceramic circuit boards were integrated into the laser devices, replacing the previous PCB materials. The enhanced thermal conductivity of DPC boards efficiently dissipated heat generated by the laser components, maintaining stable operating temperatures and preserving laser output accuracy.

Additionally, the improved signal integrity of the DPC ceramic circuit boards minimized signal loss and distortion, ensuring precise laser beam control and reliable performance. The mechanical durability of DPC boards provided resistance to external factors, increasing the overall reliability and longevity of the laser devices.

 

Result and Benefits:

Our customers are very satisfied with our products and services, and now all the circuit board in their laser equipment were supplied by us.

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