HTCC PCB
HTCC Ceramic Substrate PCB Design Making For Clock Amplifier
HTCC Ceramic Substrate PCB Design Making For Clock Amplifier
HTCC Ceramic Substrate PCB Design Making For Clock Amplifier

HTCC Ceramic Substrate PCB Design Making For Clock Amplifier

Layer Count: 6-30 Layers
Working Temperature: -40-300℃
Conductor Thickness: 2um - 12um
LS/LW: 150um (Surface layer can be refined to 50μm)
Application: Clock Amplifier
Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 HTCC Capabilities

Layer Count

4-64 Layers

Max Board Dimension

150*150mm

Min Board Thickness

1Lay: 0.1mm   0.15mm

Max Board Thickness

1Lay: 0.25mm 6.0mm

Conductor Thickness

2um - 12um (Surface layer can be thickened to 80μm)

Min Line Width/Line Space

150um (Surface layer can be refined to 50μm)

Substrate Type

AI203

Substrate Thickness

0.15-6um

Min Hole Diameter

100um

Min Hole Spacing

250um

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

No

Min Solder PAD Dia

0.1mm

Min Soldermask Bridge

75um

Min BAG PAD Margin

0.635mm

PTH/NPTH Dia Tolerance

10um

Hole Position Deviation

30-40um

Outline Tolerance

Laser: 0.005mm;Die Punch: 0.005mm

Line Width/Spac Tolerance

±20μm

Surface Treatment

Nickel-plated Gold

Thermal Stress

7.3ppm/K

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI203 

Base Material Thickness (exclude conductor)

0.15-6mm

Thermal Conductivity

17W/mk

Soldermask Type

AlN

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

15KV/mm

Dielectric Constant (MHZ)

9.4(1MHz) 9.1(13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

A Level

Thermal Conductivity (W/m.K, or W/m.C)

17W/mk

Dielectric Strength

15KV/mm

Wrap & Twist

0.003

Prototype(<1m²) Layers Normal Service Expedited Service

HTCC Ceramic PCB

6 Layer

6 - 8 weeks

3 - 4 weeks

8 Layers

6 - 8 weeks

3 - 4 weeks

10 Layers

6 - 8 weeks

3 - 4 weeks

Above 10 Layers

6 - 8 weeks

3 - 4 weeks

Production Layers Normal Service Expedited service

HTCC Ceramic PCB

6 Layer

7 - 9 weeks

4 - 5 weeks

8 Layers

7 - 9 weeks

4 - 5 weeks

10 Layers

7 - 9 weeks

4 - 5 weeks

Above 10 Layers

7 - 9 weeks

5 - 6 weeks

Clock Amplifier HTCC Ceramic PCB Manufacturing Process-Best Technology

How do we serve you?

Step one:

Our expertise lies in producing ceramic boards with superior flatness and precise printed resistor values, ensuring exceptional performance for your applications.

Step Two:

We offer flexible custom layout services, tailoring the ceramic boards to your specific design requirements. This ensures a perfect match between the board and your application.

Step Three:

Our knowledgeable technical support team is available to assist you throughout the design and production process. We are committed to resolving any issues promptly and ensuring a smooth experience.

Step Four:

We prioritize on-time delivery, ensuring your project stays on schedule. Additionally, we provide competitive pricing to meet your budgetary requirements.

Step Five:

Our manufacturing takes place in a state-of-the-art 2000 dust-free workshop, ensuring a clean and controlled environment for production.

All processes undergo rigorous quality control measures to ensure the highest standards of quality and reliability. By relying on our high-quality ceramic boards, custom layout services, professional technical support, on-time delivery, competitive pricing, and stringent quality control, we aim to exceed your expectations and provide you with the best possible experience.

Clock Amplifier HTCC Ceramic Circuit Board Design Expert-Best Technology

Background:

Precision Timing Systems specializes in the development of high-precision clock amplifiers used in critical timing applications, such as telecommunications and data centers. They required PCBs that could support precise clock signal amplification, maintain signal integrity, and provide robust performance under demanding conditions.

 

Solution:

Precision Timing Systems selected HTCC ceramic PCBs for their clock amplifier modules. The HTCC ceramic PCBs offered low signal loss, high insulation resistance, and excellent thermal stability, ensuring accurate and reliable clock signal amplification. The robust mechanical strength of the ceramic material enabled the PCBs to withstand challenging environmental conditions and mechanical stresses.

 

Result and Benefits:

The adoption of HTCC ceramic PCBs in Precision Timing Systems' clock amplifier modules resulted in improved timing accuracy and reliability. The low signal loss and high insulation resistance provided by the PCBs contributed to precise clock signal amplification, ensuring accurate synchronization in critical timing applications. The robustness and thermal stability of HTCC ceramic PCBs ensured consistent performance even in demanding environments.

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