Thin Film Circuit Board Design Production For New Energy System

Thin Film Circuit Board Design Production For New Energy System

Substrate material: 96% Al2O3
Board Thickness: 1.0mm
Conductor: 0.1umTiW+0.2mm Ni+3.0um Au
Solder Mask: N/A
Silkscreen: N/A
Surface Finishing: N/A
Application: New Energy System

Item1	Thin Film Capabilities	Special Needs
Circuit layers	1~2 Layers	N/A
Product Unit Size	0.5mmx0.5mm-200mmx200mm	0.25mmx0.25mm
Substrate Thickness Tolerance	≤ ± 10%	±0.02mm
Element Size Tolerance	±0.05mm	±0.03mm
Minimum Line Width@Thickness<3μm	20μm	10μm
Line Width Accuracy	±5μm	±2μm
Forecast Minimum Size Of Gold-tin Solder	100μm*100μm	50μm*50μm
Distance From Wire To Substrate Edge	50μm	min 20μm
Minimum Land Size Around Vias	≥Aperture+50μm	N/A
Front, Back, Multilayer Alignment Accuracy	≤ ± 5μm	± 1μm
Front, Side Alignment Accuracy	≤ 20μm	N/A
Available Cutter Width	0.1, 0.15, 0.2mm	N/A
Cutting Accuracy Of Grinding Wheel	± 50μm	± 20μm
Laser Cutting Precision	± 20μm	N/A
Minimum Hole Diameter	0.5*Board Thickness	N/A
Aperture Tolerance	± 10%	N/A
Solid Hole Diameter	0.075, 0.1mm	N/A

Item2	Attributes	Special Needs
Brand	BSTCeramicPCB	N/A
Substrate type	AlN, Al2O3, Si, Quartz, Glass-ceramic, Diamond, Sapphire	N/A
Substrate Roughness (Ra)	≤0.1μm	≤0.05μm
Coating Type	Metal film, resistive film, dielectric film, functional film, etc.	N/A
Film Thickness Tolerance	±20%	±5%
Resistive film square resistance	10-200	N/A
Resistance value accuracy (laser trimmable)	±0.1%	±0.05%
Resistance value accuracy (no laser trimming)	±5%	±3%
Temperature coefficient of resistance	±25ppm	min±10ppm

Rapid Prototype	Layer	Normal Delivery	Expedited Service
Thin Film Ceramic PCB	1	3-4.5 Weeks	2-2.5 Weeks
Thin Film Ceramic PCB	2	4-6 Weeks	2-2.5 Weeks

Mass Production	Layer	Normal Delivery	Expedited Service
Thin Film Ceramic PCB	1	4-5 Weeks	2-3 Weeks
Thin Film Ceramic PCB	2	4-6 Weeks	2-3 Weeks

Thin-film ceramic circuit boards are specialized electronic substrates made from ceramic materials using thin-film deposition techniques. These boards offer exceptional high-temperature stability, making them ideal for applications in industries such as aerospace, automotive, and telecommunications. The thin-film technology allows for precise circuitry patterns, enabling higher circuit density and improved signal integrity. With excellent resistance to thermal and mechanical stresses, these boards provide long-term reliability in harsh operating environments, making them suitable for mission-critical electronic systems.

Customer background:

RenewEco Energy Solutions Inc. is a prominent renewable energy company focused on solar inverters and energy conversion systems. With a commitment to sustainable energy solutions, RenewEco aims to drive the global adoption of renewable energy technologies.

Project Requirements:

RenewEco sought to enhance the efficiency of their solar inverters for maximizing energy conversion. The project required circuit boards with high thermal conductivity for efficient heat dissipation during energy conversion processes. To meet the demands for superior thermal conductivity, RenewEco required high-performance Thin Film Ceramic PCBs for their solar inverters. The Thin Film Ceramic PCBs were expected to efficiently dissipate heat during energy conversion, ensuring optimal performance and longevity of the solar inverters.

Project Challenges:

The Thin Film Ceramic PCB had to achieve superior thermal conductivity while maintaining precise circuitry for efficient power conversion. The challenge was to design a board that could handle high-power loads while remaining stable and reliable.

Post-Project Outcome:

RenewEco Energy Solutions was highly satisfied with the superior thermal performance of the Thin Film Ceramic PCBs. The successful implementation of the circuit boards in their solar inverters resulted in increased efficiency and enhanced energy generation. The partnership with the Thin Film Ceramic PCB manufacturer allowed RenewEco to expand its range of green energy solutions, attracting new customers seeking sustainable and high-performance energy conversion systems.