DBC/DCB Ceramic Substrate PCB For Portable Cooling Device

DBC/DCB Ceramic Substrate PCB For Portable Cooling Device

Substrate Material: AlN
Board Thickness: 1.5mm+/-10%
Conductor: 100um copper
Solder Mask: N/A
Silkscreen: N/A
Surface Finishing: ENEPIG 3u’’
Application: Portable Cooling Device

Item1	DCB/DBC Capabilities
Layer Count	1-2 Layers
Max Board Dimension	120mmx180mm
Min Board Thickness	0.254mm
Max Board Thickness	2.0mm
Conductor Thickness	100-600μm
Min Line Width/Line Space	300/300μm
Substrate Type	AI2O3
Substrate Thickness	0.254-2.0mm
Min Hole Diameter	0.25mm (No Via Hole)
Min Hole Spacing	250μm
Min PAD Ring(Single)	0.125mm
PTH Wall Thickness	N/A
Min Solder PAD Dia	0.5mm
Min Soldermask Bridge	Green Oil 130μm; Others 150μm
Min BAG PAD Margin	0.35mm
PTH/NPTH Dia Tolerance	0.075mm
Hole Position Deviation	75μm
Outline Tolerance	Laser: +/-0.13mm
Line Width/Spac Tolerance	±20%
Surface Treatment	OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated
Thermal Stress	7.3ppm/k

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI2O3
Base Material Thickness (exclude conductor)	0.45-3.2mm
Thermal Conductivity	24-170W/mk
Soldermask Type	Aluminum Oxide
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	>15KV/mm
Dielectric Constant (MHZ)	9.4 (1MHz); 9.1 (13GHz)
Water Absorption	≤0.5%
ROHS	Yes
Flammability	Grade A
Thermal Conductivity (W/m.K, or W/m.C)	24-170W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	3%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
DCB/DBC Ceramic PCB	1 Layer	2 - 3 weeks	1.5 weeks
	2 Layers	2 - 3 weeks	1.5 weeks

Production	Layers	Normal Service	Expedited service
DCB/DBC Ceramic PCB	1 Layer	3 - 4 weeks	1.5 - 2 weeks
	2 Layers	3 - 4 weeks	1.5 - 2 weeks

Portable Cooling Device DBC Ceramic PCB Manufacturing Process-Bestceramicpcb

With the expanding use of VLSI and the growth of SMT, the design of organic laminated PCBs faces considerable difficulties in terms of heat dissipation. This challenge arises from the low thermal conductivity of most conventional PCB materials. However, ceramics offer a compelling solution due to their exceptional thermal properties.

Compared to ordinary PCBs, ceramics exhibit a thermal conductivity that is approximately 90 times higher than that of epoxy glass fiber, which is commonly used in traditional PCBs. This high thermal conductivity enables ceramic PCBs to efficiently dissipate heat, making them highly suitable for applications where effective thermal management is essential. By facilitating excellent conduction cooling, ceramic PCBs prevent excessive heat buildup that can adversely affect the performance and reliability of electronic components.

DBC Ceramic PCB Specification:

Substrate material:	AlN
Board thickness:	0.56mm+/-0.1mm
Conductor:	100um copper
Solder mask:	N/A
Silkscreen:	N/A
Surface finishing:	ENEPIG 3u’’
Application:	Portable cooling device

Portable Cooling Device Direct Bonding Copper Ceramic PCB Design-Bestceramicpcb
Bioly Electronics is a company that specializes in developing innovative technologies for the life sciences industry. They are planning to design a new electrochemical biosensor for a research project, and they have decided to use a ceramic PCB as the base plate for the biosensor.
At the initial step in the design process was to select the appropriate substrate material for the biosensor. After considering various options, Bioly Electronics chose a double-sided DBC ceramic PCB due to its excellent electrical insulation and high thermal conductivity. The ceramic substrate provides a stable and reliable platform for the biosensor to function on.