LTCC Ceramic Substrate PCB Design Prototype For Power Amplifier

LTCC Ceramic Substrate PCB Design Prototype For Power Amplifier

Substrate material: 96% Al2O3
Board Thickness: 1.0mm
Conductor: 0.1umTiW+3.0um Ni
Solder Mask: N/A
Silkscreen: N/A
Surface Finishing: N/A
Application: Vehicle Electronics

Item1	LTCC Capabilities
Layer Count	4-64 Layers
Max Board Dimension	150mm×150mm
Min Board Thickness	Single layer 0.1mm, total thickness 0.15mm
Max Board Thickness	Single layer 0.25mm, total thickness 6mm
Conductor Thickness	6-12μm (the surface layer can be thickened to 80μm)
Min Line Width/Line Space	150μm (surface layer can be refined to 50μm)
Substrate Type	Al2O3
Substrate Thickness	0.15-6mm
Min Hole Diameter	100μm
Min Hole Spacing	250μm
Min PAD Ring(Single)	0.125mm
PTH Wall Thickness	N/A
Min Solder PAD Dia	0.1mm
Min Soldermask Bridge	75μm
Min BAG PAD Margin	0.635mm
PTH/NPTH Dia Tolerance	10μm
Hole Position Deviation	30-40μm
Outline Tolerance	Laser cutting: 0.005; Die stamping: 0.005
Line Width/Spac Tolerance	±20%
Surface Treatment	Immersion Gold/Nickel Palladium Gold (Surface treatment is not recommended)
Thermal Stress	7.3ppm/K

Item2	Attribute
Base Material	DP951，DP9K7, Ferro-A6-M
Base Material Thickness (exclude conductor)	0.15-6mm
Thermal Conductivity	17W/mk
Soldermask Type	Aluminum Oxide
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	9.4 (1MHz); 9.1 (13GHz)
Dielectric Constant (MHZ)	≤0.5%
Water Absorption	0%
ROHS	Yes
Flammability	Grade A
Thermal Conductivity (W/m.K, or W/m.C)	17W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	0.003

Prototype(<1m²)	Layers	Normal Service	Expedited Service
LTCC Ceramic PCB	6 Layers	6 - 8 weeks	3 - 4 weeks
	8 Layers	6 - 8 weeks	3 - 4 weeks
	10 Layers	6 - 8 weeks	3 - 4 weeks
	>10 Layers	6 - 8 weeks	3 - 4 weeks

Mass Production	Layers	Normal Service	Expedited service
LTCC Ceramic PCB	6 Layers	7 - 9 weeks	4 - 5 weeks
	8 Layers	7 - 9 weeks	4 - 5 weeks
	10 Layers	7 - 9 weeks	4 - 5 weeks
	>10 Layers	7 - 9 weeks	5 - 6 weeks

Why Best Technology?

Best Technology is thrilled to be your trusted business partner. Our primary objective is to be the leading and most professional PCB manufacturer worldwide, specifically catering to prototyping production. With over a decade of experience in the field, we are fully committed to satisfying the diverse needs of our customers across various industries. Our dedication extends to ensuring exceptional quality, timely delivery, cost-effectiveness, and fulfilling any challenging requirements you may have. As one of China's most seasoned ceramic PCB manufacturers and PCB assembly specialists, we take pride in being your ultimate business partner and reliable friend for all your PCB demands. Our goal is to streamline your R&D processes, making them effortless and efficient.

1. Material: Al2O3, AIN, Si3N4

2. Function: LTCC can be embedded with multiple passive devices through multi-layer interconnection, and combined with surface mount technology to achieve active-passive integration, greatly improving the assembly density of the circuit. Meanwhile, the dielectric constant can be controlled by changing the material, which increases the flexibility of circuit design.

3. Type: Co-fired technology.

4. Custom service available.

Background:

TechPower Solutions is a manufacturer of high-power amplifiers used in communication infrastructure. They were facing challenges in achieving efficient thermal management and compact design for their power amplifiers, which were crucial for their market competitiveness. They approached us with the objective of improving the performance and reliability of their power amplifiers. They required a solution that could effectively dissipate heat, reduce signal losses, and enable miniaturization of their amplifier modules.

Solution:

As a leading LTCC ceramic PCB supplier, we provided a comprehensive solution to address TechPower Solutions' challenges. Our team of experts collaborated closely with their engineering team to understand their specific requirements and design custom LTCC ceramic PCBs. Our Professional Approach:

Expertise in LTCC Design: With our extensive experience in LTCC technology, we utilized advanced design techniques to optimize heat dissipation and signal integrity within the power amplifier modules. Our in-depth knowledge of LTCC materials and manufacturing processes allowed us to deliver high-performance solutions.

One-Stop Service: We offered a complete range of services, from initial design and prototyping to volume production and testing. By providing a comprehensive one-stop service, we ensured seamless project execution and minimized lead times for TechPower Solutions.

Customer-Centric Approach: We placed a strong emphasis on understanding TechPower Solutions' needs and exceeding their expectations. Our team actively engaged in continuous communication, providing regular updates and incorporating feedback throughout the project. This customer-centric approach ensured a successful collaboration and a solution that precisely met their requirements.

Result and benefit:

We successfully delivered LTCC ceramic PCB solutions that addressed the thermal management and compact design challenges faced by TechPower Solutions. The collaboration resulted in enhanced performance, improved reliability, and a competitive edge for their power amplifiers in the market.