DPC PCB
Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer
Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer
Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer
Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer
Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer

Double-sided Aluminum Nitride Filter Product DPC Ceramic Circuit Board For Stabilizer

Substrate material: Aluminum Nitride
Board thickness: 1.0mm+/-0.1mm
Conductor: 35um copper on both sides
Solder mask: N/A
Silkscreen: N/A
Surface finishing: ENEPIG 3u’’
Application: Stabilizer
Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 DPC Capabilities

Layer Count

1-2 Layers

Max Board Dimension

120mmx180mm

Min Board Thickness

0.15mm

Max Board Thickness

6.0mm

Conductor Thickness

50/50μm

Min Line Width/Line Space

3/3mil (0.075/0.075mm)

Substrate Type

AI2O3, ALN, Si3N4

Substrate Thickness

0.15-6mm

Min Hole Diameter

100μm

Min Hole Spacing

250μm

Min PAD Ring(Single)

0.125mm

PTH Wall Thickness

8um

Min Solder PAD Dia

0.25mm

Min Soldermask Bridge

Green Oil 130μm; Others 150μm

Min BAG PAD Margin

0.3mm

PTH/NPTH Dia Tolerance

0.05/0.075mm

Hole Position Deviation

50-75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated

Thermal Stress

7.3pmm/k

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI2O3 

Base Material Thickness (exclude conductor)

0.15-6mm

Thermal Conductivity

24-170W/mk

Soldermask Type

Aluminum Oxide

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

15 KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170 W/mk

Dielectric Strength

>15 KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

DPC Ceramic PCB

1 Layer

DPC: 2 - 3 weeks

DPC: 1.5 weeks

2 Layers

DPC: 2 - 3 weeks

DPC: 1.5 weeks

Production Layers Normal Service Expedited service

DPC Ceramic PCB

1 Layer

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

2 Layers

DPC: 3 - 4 weeks

DPC: 1.5 - 2 weeks

Stabilizer Systems DPC Ceramic PCB Manufacturing Process-Bestceramicpcb

DPC technology refers to a special process that directly combines copper foil with alumina or aluminum nitride (one or both sides) at a suitable high temperature.

 

Basic parameter of DPC ceramic PCB

  • Substrate thickness: 0.25mm, 0.38mm,0.50mm, 0.635mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc.
  • Conductor: copper, the thickness can be 1/2OZ-10OZ
  • Min line width and space: 0.12mm (mass production), 0.10mm (prototype)
  • Finished product trace tolerance is +/-10%
  • DPC ceramic PCB is suitable for wire-bonding products
  • Solder mask is available

 

DPC Ceramic PCB specification:

Substrate material: 

Aluminum Nitride

Board thickness:

1.0mm+/-0.1mm

Conductor:

35um copper on both sides

Solder mask:

N/A

Silkscreen:

N/A

Surface finishing:

ENEPIG 3u’’

Application:

Stabilizer

Memory Module ETC Application Ceramic PCB Design Production-Bestceramicpcb

Background:

FSS is a renowned electronics manufacturing company specializing in the production of high-quality voltage regulators. With a strong reputation for delivering reliable power management solutions, they serve diverse industries and have a keen focus on technological advancements. As a leading player in the market, our client is always seeking innovative approaches to enhance the performance and reliability of their products. The client approached us with a specific challenge related to their voltage regulator design. They were facing difficulties in achieving efficient thermal management, maintaining high electrical performance, and ensuring long-term reliability in their existing designs. These challenges were limiting their ability to meet the evolving demands of their customers and compete effectively in the market.

 

Project challenge:

The smallest holes in ceramic PCB must be plated with copper foil and have a 0.05mm tolerance, it is not easy to control during manufacturing.

 

Solution:

To address the client's challenges, we proposed the incorporation of DPC (Direct Printed Ceramic) circuit boards into their voltage regulator designs. We outlined the unique advantages of DPC technology and how it could significantly enhance their product performance. Upon implementing our proposed solution, the client experienced remarkable improvements in their voltage regulator designs. The DPC ceramic circuit boards successfully addressed the thermal management challenges, resulting in enhanced reliability and extended product lifespan. The superior electrical performance of DPC boards led to improved signal integrity and reduced EMI, meeting the stringent requirements of their customers.

 

Result and Benefits:

FSS team expressed great satisfaction with the outcome of the project. Our innovative solution not only resolved their existing challenges but also provided a competitive edge in the market. The client praised our expertise, responsiveness, and ability to deliver a tailored solution that met their specific needs. As a result, the client has continued to collaborate with us on subsequent projects and recommended our services to other industry players.

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