HTCC Substrate PCB Fabricate For Signal Converter

HTCC Substrate PCB Fabricate For Signal Converter

Layer Count: 6-30 Layers
Working Temperature: -40-300℃
Conductor Thickness: 2um - 12um
LS/LW: 150um (Surface layer can be refined to 50μm)
Application: Signal Converter System

Item1	HTCC Capabilities
Layer Count	4-64 Layers
Max Board Dimension	150*150mm
Min Board Thickness	1Lay: 0.1mm 0.15mm
Max Board Thickness	1Lay: 0.25mm 6.0mm
Conductor Thickness	2um - 12um (Surface layer can be thickened to 80μm)
Min Line Width/Line Space	150um (Surface layer can be refined to 50μm)
Substrate Type	AI203
Substrate Thickness	0.15-6um
Min Hole Diameter	100um
Min Hole Spacing	250um
Min PAD Ring(Single)	0.125mm
PTH Wall Thickness	No
Min Solder PAD Dia	0.1mm
Min Soldermask Bridge	75um
Min BAG PAD Margin	0.635mm
PTH/NPTH Dia Tolerance	10um
Hole Position Deviation	30-40um
Outline Tolerance	Laser: 0.005mm;Die Punch: 0.005mm
Line Width/Spac Tolerance	±20μm
Surface Treatment	Nickel-plated Gold
Thermal Stress	7.3ppm/K

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI203
Base Material Thickness (exclude conductor)	0.15-6mm
Thermal Conductivity	17W/mk
Soldermask Type	AlN
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	15KV/mm
Dielectric Constant (MHZ)	9.4（1MHz） 9.1（13GHz）
Water Absorption	≤0.5%
ROHS	Yes
Flammability	A Level
Thermal Conductivity (W/m.K, or W/m.C)	17W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	0.003

Prototype(<1m²)	Layers	Normal Service	Expedited Service
HTCC Ceramic PCB	6 Layer	6 - 8 weeks	3 - 4 weeks
	8 Layers	6 - 8 weeks	3 - 4 weeks
	10 Layers	6 - 8 weeks	3 - 4 weeks
	Above 10 Layers	6 - 8 weeks	3 - 4 weeks

Production	Layers	Normal Service	Expedited service
HTCC Ceramic PCB	6 Layer	7 - 9 weeks	4 - 5 weeks
	8 Layers	7 - 9 weeks	4 - 5 weeks
	10 Layers	7 - 9 weeks	4 - 5 weeks
	Above 10 Layers	7 - 9 weeks	5 - 6 weeks

Best Technology provides a comprehensive range of ceramic packages that are renowned for their exceptional reliability. Our offerings include both custom-designed packages tailored to specific applications and standardized packages that are ideal for device evaluations. By utilizing our standard products during the evaluation stage, our customers can significantly reduce their initial investment costs. For further details regarding package forms and dimensions, please refer to the list of standard products outlined below.

Application:

Our ceramic packages cater to a wide range of industries, including industrial equipment and communications equipment. They are particularly well-suited for accommodating MPU (Microprocessing Units), ASIC (Application-Specific Integrated Circuits), and high-frequency devices.

Device Evaluations:

We understand the importance of thorough device evaluations prior to production. Therefore, our standardized packages are specifically designed to facilitate these evaluation processes efficiently. By utilizing our standard products, customers can save both time and resources while ensuring reliable performance.

Please reach out to us for optimized content tailored to your specific requirements or if you have any further queries. We are committed to providing the most suitable ceramic packages for your applications.

Background:

XYZ Communications required a PCB solution for their signal repeater devices, which amplify and relay wireless signals in telecommunications networks. The PCBs needed to support high-speed signal transmission, resist EMI, and maintain signal integrity in challenging environments.

Solution:

HTCC ceramic PCBs were chosen by XYZ Communications for their signal repeater devices. The ceramic material's high-frequency capabilities enabled efficient signal transmission, while the low dielectric loss ensured minimal signal degradation. The HTCC ceramic PCBs also provided excellent resistance to EMI, maintaining signal integrity in challenging environments.

Result and Benefits:

The HTCC ceramic PCBs proved to be a reliable choice for XYZ Communications' signal repeater devices. They enabled high-speed signal transmission with minimal losses, ensuring efficient signal amplification and relay. The resistance to EMI contributed to improved signal quality and reliability in telecommunications networks.