HTCC Ceramic Substrate PCB Design For Satellite Communication System

HTCC Ceramic Substrate PCB Design For Satellite Communication System

Layer Count: 6-30 Layers
Working Temperature: -40-300℃
Conductor Thickness: 2um - 12um
LS/LW: 150um (Surface layer can be refined to 50μm)
Application: Satellite Communication System

Item1	HTCC Capabilities
Layer Count	4-64 Layers
Max Board Dimension	150*150mm
Min Board Thickness	1Lay: 0.1mm 0.15mm
Max Board Thickness	1Lay: 0.25mm 6.0mm
Conductor Thickness	2um - 12um (Surface layer can be thickened to 80μm)
Min Line Width/Line Space	150um (Surface layer can be refined to 50μm)
Substrate Type	AI203
Substrate Thickness	0.15-6um
Min Hole Diameter	100um
Min Hole Spacing	250um
Min PAD Ring(Single)	0.125mm
PTH Wall Thickness	No
Min Solder PAD Dia	0.1mm
Min Soldermask Bridge	75um
Min BAG PAD Margin	0.635mm
PTH/NPTH Dia Tolerance	10um
Hole Position Deviation	30-40um
Outline Tolerance	Laser: 0.005mm;Die Punch: 0.005mm
Line Width/Spac Tolerance	±20μm
Surface Treatment	Nickel-plated Gold
Thermal Stress	7.3ppm/K

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI203
Base Material Thickness (exclude conductor)	0.15-6mm
Thermal Conductivity	17W/mk
Soldermask Type	AlN
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	15KV/mm
Dielectric Constant (MHZ)	9.4（1MHz） 9.1（13GHz）
Water Absorption	≤0.5%
ROHS	Yes
Flammability	A Level
Thermal Conductivity (W/m.K, or W/m.C)	17W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	0.003

Prototype(<1m²)	Layers	Normal Service	Expedited Service
HTCC Ceramic PCB	6 Layer	6 - 8 weeks	3 - 4 weeks
	8 Layers	6 - 8 weeks	3 - 4 weeks
	10 Layers	6 - 8 weeks	3 - 4 weeks
	Above 10 Layers	6 - 8 weeks	3 - 4 weeks

Production	Layers	Normal Service	Expedited service
HTCC Ceramic PCB	6 Layer	7 - 9 weeks	4 - 5 weeks
	8 Layers	7 - 9 weeks	4 - 5 weeks
	10 Layers	7 - 9 weeks	4 - 5 weeks
	Above 10 Layers	7 - 9 weeks	5 - 6 weeks

HTCC Ceramic PCB vs DPC Ceramic PCB

When choosing between HTCC and DPC ceramic PCBs, it is essential to consider the specific requirements of your application and weigh them against cost considerations.

HTCC Ceramic PCB

Advantages:

Excellent heat dissipation in high-temperature environments.

Design flexibility with multilayer structures for complex circuits.

Suitable for high-frequency applications with outstanding electrical insulation.

Considerations:

Relatively higher cost compared to DPC PCBs.

Best suited for demanding scenarios and applications where thermal management and high-frequency performance are critical.

DPC Ceramic PCB

Advantages:

Cost-effective option for simpler circuits.

Provides satisfactory thermal management.

Offers good electrical insulation and supports various electronic components.

Considerations:

Not as efficient in heat dissipation as HTCC PCBs.

Limited design flexibility compared to HTCC PCBs.

Ideal for applications where cost optimization is a priority and complex circuitry is not required.

Background:

SatelliteTech Solutions required PCBs for their satellite communication systems, which operate in harsh space environments. The PCBs needed to withstand extreme temperatures, vacuum conditions, and provide reliable signal processing and transmission capabilities.

Solution:

HTCC ceramic PCBs were selected by SatelliteTech Solutions for their satellite communication systems. The HTCC ceramic PCBs provided the necessary thermal stability to endure extreme temperatures in space. Their high mechanical strength ensured resistance to mechanical stresses during launch and operation. The ceramic material's high-frequency capabilities facilitated efficient signal processing and transmission.

Result and Benefits:

The HTCC ceramic PCBs met the demanding requirements of SatelliteTech Solutions' satellite communication systems. They provided reliable signal processing and transmission, withstanding extreme temperatures and vacuum conditions. The HTCC ceramic PCBs contributed to seamless communication between satellites and ground stations, enhancing the overall performance and reliability of the satellite communication systems.