AMB Ceramic PCB Design Fabricaiton For IGBT

Active Metal Brazing (AMB) technology is a further development of DBC technology. Its working principle is to use active metal elements (such as Ti/Ag/Zr/Cu) in solder to realize the combination of ceramics and metals.

Item1	AMB Capabilities
Layer Count	1-2 Layers
Max Board Dimension	100mmx100mm
Min Board Thickness	0.254mm
Max Board Thickness	1.0mm
Conductor Thickness	200-1200μm
Min Line Width/Line Space	350/400μm
Substrate Type	AIN & Si3N4
Substrate Thickness	0.254~1.0mm
Min Hole Diameter	0.3mm ( No Via Hole)
Min Hole Spacing	300μm
Min PAD Ring(Single)	0.25mm
PTH Wall Thickness	N/A
Min Solder PAD Dia	0.6mm
Min Soldermask Bridge	Green Oil 150μm; Others 180μm
Min BAG PAD Margin	0.4mm
PTH/NPTH Dia Tolerance	0.075mm
Hole Position Deviation	75μm
Outline Tolerance	Laser: +/-0.15mm
Line Width/Spac Tolerance	±20%
Surface Treatment	OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated
Thermal Stress	7.3ppm/K

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AlN
Base Material Thickness (exclude conductor)	0.45-2.7mm
Thermal Conductivity	24-170W/mk
Soldermask Type	Aluminum Nitride
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	>15KV/mm
Dielectric Constant (MHZ)	9.4 (1MHz); 9.1 (13GHz)
Water Absorption	≤0.5%
ROHS	Yes
Flammability	Grade A
Thermal Conductivity (W/m.K, or W/m.C)	24-170W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	3%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
AMB Ceramic PCB	1 Layer	AMB: 2 - 3 weeks	AMB: 1.5 weeks
	2 Layers	AMB: 2 - 3 weeks	AMB: 1.5 weeks

Production	Layers	Normal Service	Expedited service
AMB Ceramic PCB	1 Layer	AMB Ceramic PCB: 3 - 4 weeks	AMB Ceramic PCB: 1.5 - 2 weeks
	2 Layers	AMB Ceramic PCB: 3 - 4 weeks	AMB Ceramic PCB: 1.5 - 2 weeks

IGBT AMB Ceramic PCB Manufacturing Process-Bestceramicpcb

AMB (Active Metal Braze) Ceramic PCB is by using active solder to achieve the bonding between copper foil and ceramic substrate, through the selection of active solder can reduce the bonding temperature (less than 800°C), and then reduce the internal thermal stress of the ceramic substrate.

1.Material: Al2O3, AIN, Si3N4

2.Function: Ceramic PCB that use AMB technology characteristic as higher thermal conductivity, copper adhesion, lower thermal resistance and higher reliability.

3.Type: Brazing technology.

4.Custom service available.

Background:

Faster Electronics, a renowned company specializing in high-performance IGBT design and manufacturing, faced a challenge when their customer expressed concerns about insufficient thermal dissipation capabilities in their present IGBT chips. This limitation hindered the performance of their motor drivers. In their quest for a solution, they identified the potential of Si3N4 AMB ceramic substrate as a promising base material for their IGBT chips. However, they lacked a reliable supplier capable of manufacturing AMB ceramic components. Consequently, they sought the expertise of an experienced manufacturer to address this issue.

Project Challenges:

Insufficient thermal dissipation: The existing IGBT chips were unable to adequately dissipate heat, negatively impacting motor driver performance.

Lack of a reliable AMB ceramic supplier: Faster Electronics faced the challenge of finding a trustworthy manufacturer capable of producing AMB ceramic substrates to meet their specifications and quality standards.

Solution:

Recognizing the criticality of the challenge, we collaborated closely with Faster Electronics to develop a tailored solution using AMB ceramic circuit boards for their IGBT chips. Our approach encompassed the following steps:

Extensive consultation and evaluation: We thoroughly understood Faster Electronics' requirements and specifications for the AMB ceramic substrate, taking into account their thermal dissipation and reliability needs.

Customized AMB ceramic manufacturing: Leveraging our expertise in ceramic technology, we employed advanced manufacturing techniques to produce AMB ceramic substrates that aligned precisely with Faster Electronics' specifications. The substrates were meticulously designed for optimal thermal dissipation and electrical performance.