BeO Thick Film Ceramic Substrate PCB For Laser Equipment

BeO Thick Film Ceramic Substrate PCB For Laser Equipment

Layer: 2 Layer
Substrate Material: BeO
Board Thickness: 1.5mm+/-10%
Conductor: 10um AgPd + 2-5um Au
Solder Mask: Greenish Glass
Silkscreen: N/A
Application: Laser Equipment

Item1	Thick Film Capabilities
Layer Count	1-8 Layers
Max Board Dimension	120mm×180mm
Min Board Thickness	0.254mm
Max Board Thickness	2.0mm
Conductor Thickness	7-20μm
Min Line Width/Line Space	125/150μm
Substrate Type	AIN & Si3N4
Substrate Thickness	0.254~1.0mm
Min Hole Diameter	0.10mm
Min Hole Spacing	300μm
Min PAD Ring(Single)	0.25mm
PTH Wall Thickness	8-20um
Min Solder PAD Dia	0.25mm
Min Soldermask Bridge	150μm
Min BAG PAD Margin	0.25mm
PTH/NPTH Dia Tolerance	0.075mm
Hole Position Deviation	75μm
Outline Tolerance	Laser: +/-0.13mm
Line Width/Spac Tolerance	±20%
Surface Treatment	AgPt, AgPd, Au
Thermal Stress	7.3ppm/K

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI203 / ALN / BeO / SiO2
Base Material Thickness (exclude conductor)	0.45-2.7mm
Thermal Conductivity	24w / 27w / 170w
Soldermask Type	Aluminum Nitride
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	>15KV/mm
Dielectric Constant (MHZ)	9.4 (1MHz); 9.1 (13GHz)
Water Absorption	≤0.5%
ROHS	Yes
Flammability	Grade A
Thermal Conductivity (W/m.K, or W/m.C)	24-170W/mk
Dielectric Strength	15KV/mm
Wrap & Twist	3%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
Thick Film Ceramic PCB	1 Layer	3 - 3.5weeks	1-1.5 weeks
	2 Layers	3 - 4 weeks	1-1.5 weeks
	4 Layers	3 - 4 weeks	1-1.5 weeks
	6 Layers	3 - 4 weeks	1-1.5 weeks
	8 Layers	3 - 4 weeks	1.5-2 weeks

Production	Layers	Normal Service	Expedited service
Thick Film Ceramic PCB	1 Layer	3 - 3.5 weeks	2 - 2.5 weeks
	2 Layers	3 - 4 weeks	2 - 2.5 weeks
	4 Layers	3 - 4 weeks	2 - 2.5 weeks
	6 Layers	4 - 5 weeks	2 - 2.5 weeks
	8 Layers	4 - 6 weeks	2 - 2.5 weeks

Laser Equipment Thick Film Ceramic PCB Manufacturing Process-Best Technology

Thick-film ceramic PCBs play various roles in laser devices. But it's important to note that the specific applications and functions of thick film ceramic PCBs may vary depending on the type and design requirements of the laser device. Therefore, in practical applications, they may have more customized features and specific application areas, for example:

Power distribution: Thick film ceramic PCBs can be used for power distribution networks in laser devices. They can withstand high power currents and provide low-resistance conductive paths, ensuring efficient energy transmission and distribution.

Laser diode driving: In laser diode driver circuits, thick film ceramic PCBs can be used to provide a stable power supply and drive signals. They have excellent conductivity and thermal properties, enabling reliable power supply and drive circuits under high current conditions.

Temperature control: Laser devices often require temperature control for laser diodes and other key components. Thick film ceramic PCBs, with their good thermal conductivity and stability, can be used as heat dissipation substrates or temperature sensors to help stabilize and control the operating temperature of the device.

Sensor interfaces: In some laser devices, thick-film ceramic PCBs can be used for the fabrication of sensor interface circuits. They can provide suitable electrical interfaces and signal processing circuits for connecting and processing various sensor signals in the laser device.

Integrated circuit packaging: Thick film ceramic PCBs can be used for integrated circuit packaging, integrating key electronic components, sensors, and circuitry in laser devices. This helps reduce device size, increase integration, and provide reliable electrical connections and thermal management.

Background:

Our customer is a leading manufacturer of laser equipment, specializing in the development and production of high-performance laser systems for various industrial applications. With a focus on precision, reliability, and efficiency, they are renowned for delivering cutting-edge solutions to their clients worldwide.

The customer approached us with a specific challenge related to thermal management in their laser equipment. The high-power lasers used in their systems generate significant heat, which needs to be efficiently dissipated to ensure optimal performance and longevity. The customer sought a reliable solution that could effectively address thermal challenges while maintaining the integrity of their laser equipment.

And they want to use Beryllium Oxide for the ceramic substate material.

Project challenge:

Material is BeO, it has long purchase period.
Customers have strict requirements on surface cleanliness, so we should be very cautions during QC inspection.

Solution:

The application of BeO ceramic circuit boards in laser equipment has proven to be a game-changer for our customer. By leveraging the superior thermal conductivity, electrical insulation, and mechanical stability of these boards, they successfully addressed the thermal management challenges associated with high-power lasers. The integration of BeO ceramic circuit boards resulted in improved performance, reliability, and longevity of their laser equipment. As a supplier, we take pride in providing advanced solutions that enable our customers to deliver cutting-edge laser systems for diverse industrial applications.

Result and Benefits:

Customer demand was not high, but orders came in every year for a small volume, therefore, we established the long relationship with them. And this year, they sent us the assemble demand of this project for mass production.