Alumina DPC Ceramic Substrate PCB Design Manufacturing For LED

Alumina DPC Ceramic Substrate PCB Design Manufacturing For LED

Substrate material: 96% Al2O3
Board thickness: 1.0mm+/-0.1mm
Conductor: 18um copper
Solder mask: White
Silkscreen: N/A
Surface finishing: ENEPIG 3u’’
Application: LED chip

Item1	DPC Capabilities
Layer Count	1-2 Layers
Max Board Dimension	120mmx180mm
Min Board Thickness	0.15mm
Max Board Thickness	6.0mm
Conductor Thickness	50/50μm
Min Line Width/Line Space	3/3mil (0.075/0.075mm)
Substrate Type	AI2O3, ALN, Si3N4
Substrate Thickness	0.15-6mm
Min Hole Diameter	100μm
Min Hole Spacing	250μm
Min PAD Ring(Single)	0.125mm
PTH Wall Thickness	8um
Min Solder PAD Dia	0.25mm
Min Soldermask Bridge	Green Oil 130μm; Others 150μm
Min BAG PAD Margin	0.3mm
PTH/NPTH Dia Tolerance	0.05/0.075mm
Hole Position Deviation	50-75μm
Outline Tolerance	Laser: +/-0.13mm
Line Width/Spac Tolerance	±20%
Surface Treatment	OSP/Immersion Gold/Nickel Plated Gold/Immersion Silver/Nickel Plated
Thermal Stress	7.3pmm/k

Item2	Attribute
Brand	CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base Material	AI2O3
Base Material Thickness (exclude conductor)	0.15-6mm
Thermal Conductivity	24-170W/mk
Soldermask Type	Aluminum Oxide
Tg Value	800℃
Halogen Free	No
Breakdown Voltage	15 KV/mm
Dielectric Constant (MHZ)	9.4 (1MHz); 9.1 (13GHz)
Water Absorption	≤0.5%
ROHS	Yes
Flammability	Grade A
Thermal Conductivity (W/m.K, or W/m.C)	24-170 W/mk
Dielectric Strength	>15 KV/mm
Wrap & Twist	3%

Prototype(<1m²)	Layers	Normal Service	Expedited Service
DPC Ceramic PCB	1 Layer	DPC: 2 - 3 weeks	DPC: 1.5 weeks
	2 Layers	DPC: 2 - 3 weeks	DPC: 1.5 weeks

Production	Layers	Normal Service	Expedited service
DPC Ceramic PCB	1 Layer	DPC: 3 - 4 weeks	DPC: 1.5 - 2 weeks
	2 Layers	DPC: 3 - 4 weeks	DPC: 1.5 - 2 weeks

LED Lighting DPC Ceramic PCB Manufacturing Process-Bestceramicpcb

How do we control the quality of our DPC ceramic PCB?

Select high-quality ceramic materials for optimal performance.
Strictly controlling manufacturing processes for stability and reliability.
Ensuring precise dimensional accuracy and component alignment.
Conduct thorough electrical and thermal testing.
Implementing rigorous inspection and analysis procedures.
Subjecting PCBs to reliability and environmental tests.
Maintaining detailed documentation for traceability.
Continuously improving based on customer feedback and data.

DPC ceramic PCB specification:

Substrate material:	96% Al2O3
Board thickness:	1.0mm+/-0.1mm
Conductor:	18um copper
Solder mask:	White Glass Glaze
Silkscreen:	N/A
Surface finishing:	ENEPIG 3u’’
Application:	LED chip

Background:

LuminaLED Technologies is mainly supplied high-performance LED for various lighting applications. They specialize in producing energy-efficient, long-lasting LED chips that deliver superior brightness and color accuracy. And be aimed to provide lighting solutions that meet the evolving needs of the market and contribute to energy conservation efforts.

Now they faced a significant challenge in optimizing the performance and reliability of their LED chips. Conventional packaging materials used for LED chips, such as FR4, had limitations in terms of thermal management, electrical conductivity, and miniaturization. These limitations resulted in reduced brightness, increased thermal stress, and limited design flexibility for them.

Solution:

Due to the LED requiring very good heat dissipation, the size also needs to be small to match the LED, we recommended DPC ceramic PCB for them because DPC ceramic circuit boards enable precise miniaturization of LED chip packaging, allowing for compact designs and greater flexibility in product development. This feature enabled LuminaLED Technologies to create smaller, more versatile LED chip packages, expanding their range of lighting applications.

Result and Benefits:

LuminaLED Technologies expressed high satisfaction with the implementation of DPC ceramic circuit boards in their LED chip packaging and introduced two new customers for us.