Active Metal Brazing technology (AMB Ceramic PCB) is a further development of DBC technology. Its working principle is to use active metal elements (such as Ti/Ag/Zr/Cu) in solder to realize the combination of ceramics and metals.
In terms of performance, the bonding in the AMB ceramic substrate is achieved through the chemical reaction of the ceramic and the active metal solder at temperature, and the Si3N4 ceramic used in the AMB has a higher thermal conductivity than the traditional Al2O3 ceramic substrate (>90W/mK 25℃), closer to the thermal expansion coefficient of silicon (2.6x10 -6 /K), therefore, AMB substrates have higher bonding strength and reliability.
Combined with silver sintering process and high-power silicon carbide chip, the AMB copper layer with active metal coating can achieve high power, better heat dissipation and high reliability packaged modules (can withstand 3000 thermal shocks), which are now widely used For electric vehicles, electric locomotives and high-speed trains. The difference between DBC and AMB products is mainly reflected in the process technology: First, the copper and ceramics of DBC products are directly bonded, while the copper and ceramics of AMB products are brazed with active metal solder, which requires an additional silk screen process . Before brazing, the active metal solder needs to be evenly placed on the ceramic substrate; secondly, the copper of the DBC product is formed by one etching, while for the AMB product with an additional metal brazing layer, an additional Solder is removed by an etching process, usually with hydrofluoric acid.
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