Based on the thick film circuit technology, the metallization of the ceramic surface is achieved by magnetron sputtering, and the thickness of the copper layer is greater than 10 microns by electroplating, that is, DPC Ceramic PCB (Direct Plate Copper-direct copper plating substrate).

In terms of shape processing, DPC ceramic boards need to be cut by laser, which cannot be processed accurately by traditional drilling and milling machines and punching machines, so the bonding force and line width are also finer. The crystallization performance of the metal is good, the flatness is good, the line is not easy to fall off, and the line position is more accurate, the line distance is smaller, and the reliability is stable.