Thick Film PCB
Thick Film Ceramic PCB For Ozonator
Thick Film Ceramic PCB For Ozonator
Thick Film Ceramic PCB For Ozonator
Thick Film Ceramic PCB For Ozonator
Thick Film Ceramic PCB For Ozonator

Thick Film Ceramic PCB For Ozonator

Layer: 2 layers
Substrate material: 96% Al2O3
Board Thickness: 1.0mm+/-10%
Conductor: 10-15um AgPd+Ru
Solder Mask: Green Glass Glaze
Silkscreen: N/A
Application: Ozonator
Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 Thick Film Capabilities

Layer Count

1-8 Layers

Max Board Dimension

120mm×180mm

Min Board Thickness

0.254mm

Max Board Thickness

2.0mm

Conductor Thickness

7-20μm

Min Line Width/Line Space

125/150μm

Substrate Type

AIN & Si3N4

Substrate Thickness

0.254~1.0mm

Min Hole Diameter

0.10mm

Min Hole Spacing

300μm

Min PAD Ring(Single)

0.25mm

PTH Wall Thickness

8-20um

Min Solder PAD Dia

0.25mm

Min Soldermask Bridge

150μm

Min BAG PAD Margin

0.25mm

PTH/NPTH Dia Tolerance

0.075mm

Hole Position Deviation

75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

AgPt, AgPd, Au

Thermal Stress

7.3ppm/K

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI203 / ALN / BeO / SiO2

Base Material Thickness (exclude conductor)

0.45-2.7mm

Thermal Conductivity

24w / 27w / 170w 

Soldermask Type

Aluminum Nitride

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

>15KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170W/mk

Dielectric Strength

15KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

Thick Film Ceramic PCB

1 Layer

3 - 3.5weeks

1-1.5 weeks

2 Layers

3 - 4 weeks

1-1.5 weeks

4 Layers

3 - 4 weeks

1-1.5 weeks

6 Layers 3 - 4 weeks 1-1.5 weeks
8 Layers 3 - 4 weeks 1.5-2 weeks
Production Layers Normal Service Expedited service

Thick Film Ceramic PCB

1 Layer

3 - 3.5 weeks

2 - 2.5 weeks

2 Layers

3 - 4 weeks

2 - 2.5 weeks

4 Layers

3 - 4 weeks

2 - 2.5 weeks

6 Layers 4 - 5 weeks 2 - 2.5 weeks
8 Layers 4 - 6 weeks 2 - 2.5 weeks

What is manufacturing processes of ozonator ceramic PCB

Basic parameter of thick film ceramic PCB

  • Substrate Material: 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO).

  • Substrate Thickness: 0.25mm, 0.38mm, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Custom thicknesses like 1.6mm or 2.0mm are available.
  • Conductor Layer Material: Silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone).
  • Conductor Layer Thickness: ≥ 10 microns (um), maximum 20 microns (0.02mm).
  • Minimum Trace Width and Space (Volume Production): 0.30mm & 0.30mm. 0.20mm/0.20mm possible with increased cost. 0.15mm/0.20mm available for prototypes.
  • Tolerance for Final Trace Layout: +/-10%.
  • Gold Wire Bonding: Both gold and silver palladium are suitable for gold wire bonding. Special silver palladium is used for gold wire bonding upon customer request.
  • Cost Considerations: Gold palladium is significantly more expensive, approximately 10-20 times higher than silver. More resistor values on the same board increase cost.
  • Soldermask: Available upon request, working temperature >500°C, semi-transparent color.

Air Purifiers Application Ceramic PCB Design-Best Technology

Background:

EMS Electronics is a leading manufacturer of air purifiers, specializing in providing advanced solutions for clean and healthy indoor environments. With a strong focus on technological innovation and customer satisfaction, they have established themselves as a trusted brand in the air purification industry. The customer approached us with a specific challenge related to the electronic components used in their air purifiers. They required a ceramic PCB solution that could withstand the demanding conditions within the purifiers, such as exposure to airborne contaminants, high humidity, and temperature fluctuations. Additionally, they sought to enhance the overall performance and longevity of their air purification systems.

 

Solution:

By leveraging the benefits of thick film ceramic circuit boards and constant trials, we successfully supported our customer in developing high-performance air purifiers. The integration of advanced filtration technologies, efficient heat dissipation, and customization options enabled the customer to create innovative and reliable air purification systems. The resulting air purifiers offered improved filtration efficiency, enhanced reliability, and optimal space utilization, providing customers with clean and healthy indoor air. As a dedicated PCB supplier, we

As a dedicated PCB supplier, we take pride in delivering solutions that meet the unique needs of our customers.

 

Result and Benefits:

The use of our thick film ceramic circuit boards has allowed the customer to develop air purifiers that meet the highest standards of performance and reliability. This has resulted in increased customer satisfaction and loyalty. In this year, the EMS engineer and boss came to our factory and discussed the details of this project, such as the end application, the quantity demand and annual output, then placed 30,000 pieces order to us.

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