Thick Film PCB
Thick Film Ceramic Substrate Board For Communication
Thick Film Ceramic Substrate Board For Communication
Thick Film Ceramic Substrate Board For Communication
Thick Film Ceramic Substrate Board For Communication
Thick Film Ceramic Substrate Board For Communication
Thick Film Ceramic Substrate Board For Communication

Thick Film Ceramic Substrate Board For Communication

Layer: 2 Layers
Substrate material: 96% Al2O3
Board thickness: 0.635mm+/-0.1mm
Conductor: 10-15um AgPd-5um Au
Solder mask: Green Glass Glaze
Silkscreen: N/A
Application: Communication

Ceramic PCB Capabilities Ceramic PCB Material Prototype Lead Time Mass Production Lead Time
Item1 Thick Film Capabilities

Layer Count

1-8 Layers

Max Board Dimension

120mm×180mm

Min Board Thickness

0.254mm

Max Board Thickness

2.0mm

Conductor Thickness

7-20μm

Min Line Width/Line Space

125/150μm

Substrate Type

AIN & Si3N4

Substrate Thickness

0.254~1.0mm

Min Hole Diameter

0.10mm

Min Hole Spacing

300μm

Min PAD Ring(Single)

0.25mm

PTH Wall Thickness

8-20um

Min Solder PAD Dia

0.25mm

Min Soldermask Bridge

150μm

Min BAG PAD Margin

0.25mm

PTH/NPTH Dia Tolerance

0.075mm

Hole Position Deviation

75μm

Outline Tolerance

Laser: +/-0.13mm

Line Width/Spac Tolerance

±20%

Surface Treatment

AgPt, AgPd, Au

Thermal Stress

7.3ppm/K

Item2 Attribute

Brand

CeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba

Base Material

AI203 / ALN / BeO / SiO2

Base Material Thickness (exclude conductor)

0.45-2.7mm

Thermal Conductivity

24w / 27w / 170w 

Soldermask Type

Aluminum Nitride

Tg Value

800℃

Halogen Free

No

Breakdown Voltage

>15KV/mm

Dielectric Constant (MHZ)

9.4 (1MHz); 9.1 (13GHz)

Water Absorption

≤0.5%

ROHS

Yes

Flammability

Grade A

Thermal Conductivity (W/m.K, or W/m.C)

24-170W/mk

Dielectric Strength

15KV/mm

Wrap & Twist

3%

Prototype(<1m²) Layers Normal Service Expedited Service

Thick Film Ceramic PCB

1 Layer

3 - 3.5weeks

1-1.5 weeks

2 Layers

3 - 4 weeks

1-1.5 weeks

4 Layers

3 - 4 weeks

1-1.5 weeks

6 Layers 3 - 4 weeks 1-1.5 weeks
8 Layers 3 - 4 weeks 1.5-2 weeks
Production Layers Normal Service Expedited service

Thick Film Ceramic PCB

1 Layer

3 - 3.5 weeks

2 - 2.5 weeks

2 Layers

3 - 4 weeks

2 - 2.5 weeks

4 Layers

3 - 4 weeks

2 - 2.5 weeks

6 Layers 4 - 5 weeks 2 - 2.5 weeks
8 Layers 4 - 6 weeks 2 - 2.5 weeks

What is manufacturing process of communication ceramic PCB-Best Technology

How Best Technology Serve You?

  1. Superior Ceramic Boards: Our expertise lies in producing ceramic boards with exceptional flatness and precise printed resistor values, ensuring high-quality performance for your applications.
  2. Custom Layout Services: We offer flexible custom layout services, tailoring the design of ceramic boards to perfectly match your specific requirements, guaranteeing optimal functionality and fit.
  3. Professional Technical Support: Our dedicated technical support team is here to assist you every step of the way, providing expert guidance and resolving any design or production issues promptly and efficiently.
  4. On-Time Delivery and Competitive Pricing: We prioritize on-time delivery to meet your project timelines and offer competitive pricing that aligns with your budget, providing excellent value for your investment.
  5. Stringent Quality Control: Our manufacturing takes place in a state-of-the-art, 2000-class dust-free workshop. Each production process undergoes rigorous quality control measures, ensuring the highest level of product quality and reliability.
  6. Quality Certifications and Traceability: We hold prestigious certifications, including ISO 9001, ISO 13485, and IATF 16949, showcasing our commitment to maintaining the highest quality standards. Our dedicated QC team diligently monitors all manufacturing processes, ensuring adherence to these standards. With comprehensive traceability measures in place, we can provide detailed data and documentation for complete transparency and accountability.

Thick Film Ceramic PCB specification:

Substrate material:

96% Al2O3

Board thickness:

0.835mm+/-10%

Conductor:

10-15um AgPd

Solder mask:

Green

Silkscreen:

N/A

Surface finishing:

N/A

Application:

Communication

Specified Product Application Ceramic PCB Design For Communication-Best Technology

Background:

Intercone electronics is a telecommunications medium-sized enterprise specializing in the development and manufacturing of high-frequency communication systems. Their products range from wireless routers to advanced network infrastructure equipment. In the digital age, the demand for faster and more reliable communication systems continues to grow. The customer faced challenges such as signal interference, heat dissipation, and signal loss, which affected the overall performance and reliability of their products. Meanwhile, they encountered several challenges in their communication systems. Traditional PCB materials struggled to provide the necessary thermal management, leading to heat-related failures and reduced signal integrity. Additionally, the limitations of standard PCB substrates posed obstacles in achieving high-frequency operation and efficient signal transmission. To address these issues, they turned to thick film ceramic boards as a potential solution.

 

Solution:

Due to the low dielectric loss and high signal transmission needed, we recommend the aluminum oxide material for the ceramic PCB, and developed a customized ceramic circuit layout according to the customer’s requirements. The thick film ceramic boards were designed to optimize signal transmission and thermal management, enabling improved performance and reliability. The unique material composition and layout minimized signal loss, enhanced signal integrity, and effectively dissipated heat, resulting in more efficient and durable communication systems.

The implementation of thick film ceramic boards had a significant impact on the customer's communication systems. The improved thermal management capabilities prevented heat-related failures and extended the lifespan of their products. Enhanced signal integrity and reduced signal loss led to better overall performance and increased customer satisfaction.

 

Result and Benefits:

When apply the ceramic PCB into the customer's wireless router, it demonstrated higher stability, faster data transfer rates, and improved signal reliability. Customer praise that we did a good job for them, and now we are working together on a new wire router project.

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